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 Single Line TVS Diode for ESD Protection in Portable Electronics
PROTECTION PRODUCTS Description
The SDxx TVS diodes are designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. They offer superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. The SDxx series TVS diodes are designed to protect sensitive semiconductor components from damage or upset due to electrostatic discharge (ESD) and other voltage induced transient events. The SDxx is in a SOD-323 package and will protect one unidirectional line. They are available with working voltages of 5 volts (SD05) and 12 volts (SD12). These devices will fit on the same PCB pad area as an 0805 MLV device. They give the designer the flexibility to protect one line in applications where arrays are not practical. Additionally, it may be sprinkled around the board in applications where board space is at a premium. They may may be used to meet the ESD immunity requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV contact discharge).
SD05 & SD12
Features
u 350 Watts peak pulse power (tp = 8/20s) u Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (tp = 5/50ns) IEC 61000-4-5 (Lightning) 24A (tp = 8/20s) Small package for use in portable electronics Suitable replacement for MLVs in ESD protection applications Protects one I/O or power line Low clamping voltage Working voltages: 5V & 12V Low leakage current Solid-state silicon-avalanche technology
u u u u u u u u u u u u u u u u u
Mechanical Characteristics
EIAJ SOD-323 package Molding compound flammability rating: UL 94V-0 Marking : Marking code, cathode band Packaging : Tape and Reel per EIA 481
Applications
Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants (PDAs) Notebooks, Desktops, & Servers Portable Instrumentation Pagers Peripherals
Schematic & PIN Configuration
1
2
SOD-323 (Top View)
Revision 9/2000
1
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SD05 & SD12
PROTECTION PRODUCTS Absolute Maximum Rating
R ating Peak Pulse Pow er (tp = 8/20s) Peak Pulse Current (tp = 8/20s) ESD Voltage (HBM Waveform p er IEC 61000-4-2) Lead Soldering Temp erature Op erating Temp erature Storage Temp erature Symbo l Pp k I PP V PP TL TJ TSTG Value 350 24 30 260 (10 sec.) -55 to +125 -55 to +150 Units Watts A kV C C C
Electrical Characteristics
SD05 Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbo l VRWM V BR IR VC VC Cj It = 1mA VRWM = 5V, T=25C IPP = 5A, tp = 8/20s IPP = 24A, tp = 8/20s V R = 0V, f = 1MHz 6 10 9.8 14.5 350 Co nd itio ns Minimum Typ ical Maximum 5 Units V V A V V pF
SD12 Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Clamp ing Voltage Junction Cap acitance Symbo l VRWM V BR IR VC VC Cj It = 1mA VRWM = 12V, T=25C IPP = 5A, tp = 8/20s IPP = 15A, tp = 8/20s VR = 0V, f = 1MHz 13.3 1 19 25 150 Co nd itio ns Minimum Typ ical Maximum 12 Units V V A V V pF
a 2000 Semtech Corp.
2
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SD05 & SD12
PROTECTION PRODUCTS Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10 Peak Pulse Power - PPP (kW)
110 100 % of Rated Power or IPP 90 80 70 60 50 40 30 20 10 0
Power Derating Curve
1
0.1
0.01 0.1 1 10 Pulse Duration - tp ( s) 100 1000
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Waveform
110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (s) 20 25 30 td = IPP/2 e
-t
Clamping Voltage vs. Peak Pulse Current
Waveform Parameters: tr = 8s td = 20s
30 25 SD12 20 15 SD05 10 5 0 0 5 10 15 20 25 30 Peak Pulse Current - IPP (A) Waveform Parameters: tr = 8s td = 20s
Clamping Voltage - VC (V)
a 2000 Semtech Corp.
3
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SD05 & SD12
PROTECTION PRODUCTS Applications Information
Device Connection Options
Device Schematic & Pin Configuration
The SDxx TVS diodes are designed to protect one data, I/O, or power supply line. The device is designed to replace multi-layer varistors (MLVs) in portable applications. It is easily implemented on existing 0805 MLV pads and is only slightly larger than 0603 MLV pads. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information):
l l l l
Size Comparison to 0805 MLV
l l l l l
Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. The ESD transient return path to ground should be kept as short as possible. Place a TVS & decoupling capacitor between power and ground of components that may be vulnerable to electrostatic discharges to the ground plane. Minimize all conductive loops including power and ground loops. Use multilayer boards when possible. Minimize interconnecting line lengths Never run critical signals near board edges. Fill unused portions of the PCB with ground plane.
SOD-323 Note: Nominal dimensions in inches
0805 MLV
Component Placement Comparison
0805 MLV on 0805 Solder Pad
SOD-323 on 0805 MLV Pad
SOD-323 on Recommended (SOD-323) Solder Pad
a 2000 Semtech Corp.
4
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SD05 & SD12
PROTECTION PRODUCTS Outline Drawing - SOD-323
Land Pattern - SOD-323
a 2000 Semtech Corp.
5
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SD05 & SD12
PROTECTION PRODUCTS Marking Codes
Par t Numbe r SD05 SD12 Mar king Co d e 5U 6U
Ordering Information
P ar t Numbe r SD05.TC SD05.TG SD12.TC SD12.TG Wo r king Vo ltage 5V 5V 12V 12V Qty p e r Reel 3,000 10,000 3,000 10,000 R e e l Size 7 13 7 13
Contact Information
Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804
a 2000 Semtech Corp. 6 www.semtech.com


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